Advanced Packaging Integration Engineer
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Academic Positions
Stockholm
Join the Platform Efficiency Team at imec's R&D headquarters located in the heart of Europe and help strengthen technology and modules across imecs many programs. This position lies in the BEOL Platform team, which takes care of 3D, Memory and Interconnect projects. At this point in time we have a particular need for an experienced Advanced Packaging (3D) Integration engineer. What you will... |
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5 dagar sedan
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